San Diego, CA April 30, 2014: Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, announced that Casey Krawiec has been promoted to global sales and marketing director.
QP Technologies’ substrate experts will help you determine and develop the right substrate for your high-performance device requirements.
San Diego, CA April 30, 2014: Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, announced that Casey Krawiec has been promoted to global sales and marketing director.