San Diego, CA – May 29, 2018: Quik-Pak, a division of Promex and provider of IC packaging, assembly, and wafer preparation services, is exhibiting prototype services for RF devices and sensors supporting 5G and IoT in Booth 408 at the Electronic Components and Technology Conference.
Skilled Custom Substrate Development
for High-Speed, High-Power Devices
QP Technologies’ substrate experts will help you determine and develop the right substrate for your high-performance device requirements.