Multi Chip Module
![](https://www.qptechnologies.com/wp-content/uploads/2020/11/Multi-chip_2_v3-1024x929.png)
QP Technologies’ (formerly Quik-Pak) flexible assembly processes can accommodate the bonding of multiple components, including die and discretes, on a single substrate.
QP Technologies’ substrate experts will help you determine and develop the right substrate for your high-performance device requirements.
QP Technologies’ (formerly Quik-Pak) flexible assembly processes can accommodate the bonding of multiple components, including die and discretes, on a single substrate.