Technical Information
QP Technologies (formerly Quik-Pak) strives to provide our customers with the latest information about our wide variety of microelectronic packaging and assembly and wafer preparation products and services. Please check back often to find updated information and new offerings.
Data Sheet | Download |
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Open Cavity Plastic Packages (OCPP) iMAPS 2022 Poster Presentation Handout | Download |
Design Rules for Package Substrates | Download |
Wafer Preparation & Die Sort Datasheet | Download |
Open-molded Plastic Package (OmPP®) Datasheet | Download |
Open-molded Plastic Package Part Number Table Datasheet | Download |
Open Cavity Plastic Packages (OCPP) Datasheet | Download |
Prototype Assembly Services Datasheet | Download |
Encapsulation Options Datasheet | Download |
Flip Chip Packaging & Advanced Assembly Services Datasheet | Download |
Laser Micromachining and Manufacturing Datasheet | Download |
BGA Balling Services Datasheet | Download |
Ceramic Packaging and Assembly Datasheet | Download |