QP Technologies is sponsoring The International Conference on Advanced Packaging for Power Electronics on May 8-9 in Boston-Woburn. The Conference will bring together technologists from a diverse collection of disciplines in power semiconductor packaging, application development, reliability, modeling, process development, thermal management, and advanced materials/manufacturing to support the next generation of power electronics development.
QP Technologies’ senior process engineer Sam Sadri will be giving a presentation on May 8, titled Power Electronics on Packaging Solution Development for Double-Sided Power Switch. Email us at info@qptechnologies.com to schedule a time to meet with our experts.