SANTA CLARA, CA – AUGUST 23, 2016: IC Packaging Solutions Provider/IMAPS Premier Corporate Member Sponsors Technical Presentation in San Diego Aug. 23, Exhibits at IMAPS Technology Workshop in New York Sept. 22, 2016.
QP Technologies’ substrate experts will help you determine and develop the right substrate for your high-performance device requirements.
SANTA CLARA, CA – AUGUST 23, 2016: IC Packaging Solutions Provider/IMAPS Premier Corporate Member Sponsors Technical Presentation in San Diego Aug. 23, Exhibits at IMAPS Technology Workshop in New York Sept. 22, 2016.