San Diego, CA April 10, 2014: Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, has expanded its transfer molding and assembly capabilities to accommodate the increased demands of innovative companies in the wireless electronics and solar industries.
Skilled Custom Substrate Development
for High-Speed, High-Power Devices
QP Technologies’ substrate experts will help you determine and develop the right substrate for your high-performance device requirements.