San Diego, CA, September 27 2011:Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, was awarded a plaque today by the International Microelectronics and Packaging Society (IMAPS) for their support as a premier corporate member of the organization.
Skilled Custom Substrate Development
for High-Speed, High-Power Devices
QP Technologies’ substrate experts will help you determine and develop the right substrate for your high-performance device requirements.