November 2024 Newsletter
Subscribe to our email newsletter to stay updated on what’s happening at QP Technologies and our parent company, Promex Industries! Read our November 2024 newsletter for more on:
Blog
Leveraging Custom Substrates to Deliver Quickturn Packaging and Assembly Solutions
Substrate materials play an important role in microelectronics. Serving as the backbone of integrated circuit assemblies, substrates promote mechanical strength and electrical connectivity. Manufacturers choose from a range of substrate materials when building devices, including advanced laminates such as FR-4, FR-5, BT and ABF. Driven by the advancement of applications […]
July 2024 Newsletter
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Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President
Two companies heightening focus on individual core competencies to better pursue rapidly expanding business opportunities. SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, and its San Diego-based division QP Technologies, a leading provider of innovative microelectronic packaging and assembly […]
QP Technologies™ Expands Die Preparation Business
Adds Fully Automated Dicing Saw to Equipment Line, Enabling Even Greater Precision, Throughput for Die Singulation ESCONDIDO, Calif. – June 19, 2024 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has added a state-of-the-art dicing saw to its manufacturing line, expanding its […]
QP Technologies™ Achieves ANSI/ESD S20.20 Certification
Certification and Ongoing Monitoring Assures Customers of Manufacturing Operations’ ESD Control and Safety ESCONDIDO, Calif. – April 11, 2024 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America Inc. – one of only six […]
February 2024 Newsletter
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QP Technologies™ Achieves ISO Certifications from Global Auditing and Certification Body TÜV SÜD America Inc.
ESCONDIDO, Calif., Nov. 28, 2023 (GLOBE NEWSWIRE) — QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has achieved ISO 9001:2015 and ISO 13485:2016 certifications from globally recognized standards auditing and certification body TÜV SÜD America Inc. (TÜV SÜD). Developed and published by the International […]
November 2023 Newsletter
July 2023 Newsletter
ECTC 2023: 3D InCites Podcast
Listen to 3D InCites recently published CHIPS Act podcast from ECTC 2023. Our CEO, Dick Otte, is featured at 13:55 in which he discusses the impact of the CHIPS Act and his key takeaways from ECTC’s special discussion panel on the act itself.
ECTC 2023: Chips ACT Implications Presentation – Dick Otte, CEO
This brief presentation was the third given at the start of the “Special Session on the CHIPS Act Implications” at ECTC 2023 in Orlando Florida. The two proceeding talks were by Carl McCants, DARPA and Robert Rudnitsky, NIST. Other panelists were; Hern Takiar, Micron; Joshua Dillon, Marvell; Subramanian Iyer, UCLA. The […]