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ECTC 2023: Chips ACT Implications Presentation – Dick Otte, CEO

This brief presentation was the third given at the start of the “Special Session on the CHIPS Act Implications” at ECTC 2023 in Orlando Florida. The two proceeding talks were by Carl McCants, DARPA and Robert Rudnitsky, NIST. Other panelists were; Hern Takiar, Micron; Joshua Dillon, Marvell; Subramanian Iyer, UCLA.  The […]

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Enabling New Functionality in Medtech and Biotech Devices

By Dick Otte, CEO, Promex Industries Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of manufacturing challenges and demands that require heterogeneous […]

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Optimizing Chiplet Packaging for Complex Applications

By Dick Otte, CEO, Promex Industries Cost and performance are the two most pressing issues in chip design and manufacturing. Chiplets are a key solution being pursued by the semiconductor industry to help mitigate these challenges. These small die with specialized functionality are designed to be combined to make up a […]

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QP Technologies™ Broadens Microelectronics Plastic-Package Portfolio

New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad plastic package assembly portfolio with two new offerings: a 64-pin thin quad flat pack […]

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Panel Tackles Chiplet Packaging Challenges

By Dean Freeman QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California. Dick Otte, CEO of our parent company Promex Industries, participated on a panel titled “Best Packaging for Chiplets Today.” Moderated by Nobuki Islam with JCET Group, the packaging panel also included […]

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