Blog
March 2022 Newsletter
Managing MIL-STD-883 IC Compliance
The military-aerospace market has stringent requirements for parts designed into air, spacecraft, and associated systems. Proven IC and board packaging approaches are essential for enabling system designers to use commercially developed components in military and aerospace applications. MIL-STD-883 is the military testing standard that determines uniform procedures and methodologies for […]
February 2022 Newsletter
January 2022 Newsletter
December 2021 Newsletter
November 2021 Newsletter
QP Technologies Partners with AnySilicon
AnySilicon, the leading marketplace for semiconductor service providers, announced today that QP Technologies, a worldwide leader in packaging and assembly services, has partnered with AnySilicon to promote its IC packaging and assembly services. As part of the AnySilicon platform, QP Technologies will gain access to a full range of online marketing services to showcase its offering, increase exposure and generate leads.
Aluminum Wire Bonding Key for Power Electronics
A few months ago, we announced that we had expanded our wire bonding offerings by adding two bonders from Hesse Mechatronics to our manufacturing line. The systems – a Bondjet BJ855 fine wire wedge bonder and a Bondjet BJ939 heavy wire wedge bonder – deliver industry-leading bonding speed and large […]
iMAPS 2021 Recap – A Great Show
Earlier this month, we were excited to be live onsite at iMAPS 2021 in San Diego, just down the freeway from our manufacturing facility in Escondido. It was great to meet with and talk to attendees in person, chatting with folks in our booth and getting a chance to talk […]