Microelectronics & Semiconductor Blog

QP Technologies™ Sees Double-Digit Growth, Expands Team and Offerings to Meet Customer Needs

Demand for Packaging and Assembly Expertise Continues to Escalate ESCONDIDO, Calif. – Sept. 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, has added multiple new positions and capabilities to accommodate rising customer requirements. The company emerged from the global pandemic stronger […]

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September 2021 Quick Shots

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September 2021 Newsletter

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3dInCites Podcast: A Conversation about Onshore Advanced Packaging in the US

The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which […]

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QP Technologies™ Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets

Hesse Fine and Heavy Wire Bonders Enable Fully Automated Processing of Assembly Projects ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned […]

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August 2021 Quick Shots

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August 2021 Newsletter

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Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions

Medina to lead sales and marketing activities for the company’s Promex Medical and Biotech and QP Technologies Entities SANTA CLARA, Calif. – July 20, 2021 – Promex Industries, a biotech microelectronics manufacturer specializing in heterogeneous integration of key subsystems for medical, diagnostic, and life sciences devices, announced that industry veteran and […]

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July 2021 Quick Shots

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July 2021 Newsletter

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Rethinking “Business as Usual”

By Rosie Medina, Vice President, Sales and Marketing Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like […]

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QP Technologies™ Expands Interposer Design Capabilities

Leverages Substrate Design Services to Create Flexible, Low-Cost Packaging Solutions ESCONDIDO, Calif. – March 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the company’s substrate design services announced last year. […]

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