Santa Clara, CA – August 27, 2018: The Quik-Pak Division of Promex will exhibit air cavity plastic QFNs and overmolded QFNs at the 30th Annual Electronics Packaging Symposium (EPS), September 18 – 19, 2018 in Binghamton, New York. Download Press Release

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San Diego, CA – June 8, 2018: Quik-Pak, a division of Promex providing innovative microelectronic packaging and assembly solutions for complex devices, will exhibit Air Cavity Plastic and Overmolded QFN Packages for RF/microwave, MEMS and sensor applications in Booth 809 at the IEEE MTT International Microwave Symposium (IMS), June 10-15, […]

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San Diego, CA – May 25, 2018: ECTC, May 29 – June 1, 2018, Booth #408 / IMS, June 12 – June 14, 2018, Booth #809 / Sensors Expo & Conference, June 26 – June 28, 2018, Booth #1526.

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San Diego, CA – May 29, 2018: Quik-Pak, a division of Promex and provider of IC packaging, assembly, and wafer preparation services, is exhibiting prototype services for RF devices and sensors supporting 5G and IoT in Booth 408 at the Electronic Components and Technology Conference.  Download Press Release

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San Diego, CA – March 5, 2018: Quick-Turn Engineering Builds of Custom Designs Available Five Weeks After Drawing Approval; QFNs on Display at APEC Conference in San Antonio, TX March 5-7, 2018 Booth #758 & GOMATECH Conference in Miami, FL March 12-15, 2018 Booth #318 Download Press Release

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San Diego, CA – October 10, 2017: Microelectronic Packaging and Assembly Solutions Provider Exhibits at IMAPS 2017 International Symposium Oct. 10-11, Raleigh, NC, Booth 210 Download Press Release

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Santa Clara, CA – September 19, 2017: Electronic Packaging Symposium (EPS), International Conference on Silicon Carbide & Related Materials (ICSCRM) Provide Opportunities to Share Advances, Investigate Future Solutions Download Press Release

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San Diego, CA – PR Newswire June 1, 2017: Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions for complex devices, will exhibit Air Cavity Plastic QFN Packages and Overmolded QFN Packages in Booth 732 at the IEEE MTT International Microwave Symposium (IMS), June 4-9, 2017 in Honolulu, HI. […]

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SANTA CLARA, CA – MAY 2, 2017: Promex will showcase its heterogenous assembly services for complex medical and biotech devices, and its Quik-Pak Division will exhibit Open-molded Plastic Packages (OmPP) and air cavity QFN (Quad Flat No-Lead) Packages in Booth 215 at The Electronic Components and Technology Conference (ECTC) in […]

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SAN DIEGO, CA – SEPTEMBER 11, 2016: Quik-Pak, a provider of microelectronic chip packaging and assembly solutions, will receive the International Microelectronics Assembly and Packaging Society (IMAPS) 2016 Corporate Recognition Award at the industry organization’s 49th International Symposium on Microelectronics on October 11, 2016 in Pasadena, Calif. Download Press Release

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SANTA CLARA, CA – AUGUST 23, 2016: IC Packaging Solutions Provider/IMAPS Premier Corporate Member Sponsors Technical Presentation in San Diego Aug. 23, Exhibits at IMAPS Technology Workshop in New York Sept. 22, 2016. Download Press Release

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SANTA CLARA, CA – JUNE 30, 2016: Microelectronics Services Providers to Promote Capabilities Designed to Accelerate Time to Market at MEPTEC Medical Electronics Symposium in Portland, OR, September 14-15, 2016 Download Press Release

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