Blog

Substrate materials play an important role in microelectronics. Serving as the backbone of integrated circuit assemblies, substrates promote mechanical strength and electrical connectivity. Manufacturers choose from a range of substrate materials when building devices, including advanced laminates such as FR-4, FR-5, BT and ABF. Driven by the advancement of applications […]

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The military-aerospace market has stringent requirements for parts designed into air, spacecraft, and associated systems. Proven IC and board packaging approaches are essential for enabling system designers to use commercially developed components in military and aerospace applications. MIL-STD-883 is the military testing standard that determines uniform procedures and methodologies for […]

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A few months ago, we announced that we had expanded our wire bonding offerings by adding two bonders from Hesse Mechatronics to our manufacturing line. The systems – a Bondjet BJ855 fine wire wedge bonder and a Bondjet BJ939 heavy wire wedge bonder – deliver industry-leading bonding speed and large […]

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Earlier this month, we were excited to be live onsite at iMAPS 2021 in San Diego, just down the freeway from our manufacturing facility in Escondido. It was great to meet with and talk to attendees in person, chatting with folks in our booth and getting a chance to talk […]

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The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which […]

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By Rosie Medina, Vice President, Sales and Marketing Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like […]

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By Ken Molitor, Chief Operating Officer, QP Technologies A new year always brings the promise of a fresh start, a chance to reset, reinvigorate and perhaps refocus goals and objectives. This may never have been truer than when 2021 arrived. In February 2020, we moved our operations into our new, […]

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The push to create smaller, thinner and denser chip packages is on… and has been for some time. A few years ago, it became clear that the way forward for the semiconductor industry was to intensify the focus on heterogeneous integration (HI)—integrating separately manufactured components into a system-in-package (SIP), a […]

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