News

San Diego, CA, June 1st 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly announced today its exclusive Open-molded Plastic Package (Ompp)™. The product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective […]

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Hayward, CA, May 5th, 2011: Delphon Industries, a leader in handling, processing, and packaging of high technology components and medical devices announced today a partnership with Neu Dynamics Corporation to offer turnkey packaging solutions. Neu Dynamics has provided tool and die manufacturing and precision mold making, including encapsulation mold making and […]

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San Diego, CA, April 12, 2011:Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an exclusive Open-molded Plastic Package (OmPP)™. A pre-molded QFN (Quad Flat No-Lead) designed to provide a high quality, fast solution for IC packaging and assembly needs.

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San Diego, CA, March 3, 2011: Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an innovative approach to prototype die bumping. Download Press Release

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San Diego, CA, Febuary 4 2011:Quik-Pak Hosts IMAPS Event About the Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology. IMAPS Event begins on Tuesday, February 22 at 12:00. Download Press Release

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San Diego, CA, November 10, 2010:Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has expanded its services to include submicron placement accuracy as part of its flip chip bonding capabilities. Download Article

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San Diegom CA, October 26 2010: The technical presentation addresses the status of die stacking in the industry and the challenges of die stacking, especially for RF devices. Skyworks Solutions has reduced die sizes for silicon and GaAs, introduced the smallest component sizes called “01005”, and has shrunk the available gaps […]

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San Diego, CA, October 10, 2010: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has entered into a contract with UltraComm for the packaging and assembly of electro/optic Cores. Download Press Release

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February 2010: Julie Adams, Quik-Pak Sales Director, discusses “selling time” in the Feb. issue of US Tech. Read the Article

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January 12, 2010: Jeanne Beacham, Delphon CEO, discusses her outlook on 2010 in Semiconductor Packaging News Viewpoint Article. Read the Article

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November 2009: Infrastructure Advisor’s Ron Lecke and Quik-Pak’s Howard Lenos discuss the latest in CZT Detector Assembly. Read the Article

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San Diego, CA, August 25, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced today that they have received their official International Traffic in Arms Regulations (ITAR) registration from the US Department of State, Bureau of Political-Military […]

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