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San Diego, CA, April 16, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced the completion of its new expanded facility today. The company has added 5,800 sq ft of new clean manufacturing space which houses advanced […]

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San Diego, CA, February 2, 2009: Quik-Pak, a division of Delphon Industries and leading provider of custom IC Assembly, Wafer Backgrinding and Dicing, and patented Open Cavity Package services announced the launch of its new website today. The site was developed to more effectively deliver technical information regarding the company’s increased […]

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San Diego, CA, September 25, 2008: Quik-Pak, a division of Delphon Industries, announced today the acquisition of Aguila Technologies’ flip chip assembly, detector array processing, and laser micromachining business units. The acquisition is part of Quik-Pak’s ongoing effort to expand its advanced packaging and assembly services. Download Press Release

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San Diego, CA, September 1, 2008: Quik-Pak, a division of Delphon Industries, announced today that it will exhibit at the upcoming GSA Suppliers Expo October 2, 2008. The company plans on showing conference attendees its full turnkey solutions for their IC packaging and prototyping needs. Download Press Release

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San Diego, CA, March 28, 2008: Quik-Pak, a division of Delphon Industries, announced today that it has met the strict requirements for ISO compliance and has been awarded ISO 9001:2000 certification for its IC packaging, assembly and prototyping services. Download Press Release

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