Custom Substrates Expertise for High-Performance Devices
High-speed, high-performance devices, such as power semiconductors and chips for solid-state drives (SSDs), have unique development requirements that customized solutions are often better able to address than off-the-shelf boards. This is especially true when the device is being developed by a U.S.-based firm for an end application such as military/aerospace that stipulates an onshore provider. QP Technologies’ substrate development team can help you quickly determine and develop the best substrate for your device requirements.
In our latest white paper, you will learn…
- Why power, RF and SSD devices pose challenges for development of reliable, production-worthy board solutions
- The role of the substrate in enabling build-up of complex devices using advanced, new laminate materials
- How to determine the best approach for achieving necessary device performance
- Why QP Technologies engineers are uniquely qualified to assess your needs for a custom substrate and work with you on design, development, assembly and fabrication
- Examples of projects for which we developed custom substrate solutions, meeting customers’ requirements for:
- Fast-turn development and delivery of multiple designs and builds
- IP verification utilizing existing test system hardware
Download today and get started on your next custom substrate development project.
ABOUT US
QP Technologies (formerly Quik-Pak), a division of Promex Industries, is based in Escondido, Calif. We are leaders in microelectronic packaging, assembly, wafer processing, substrate design, and other related services. Our 20,000-square-foot facility is ISO 9001:2015 and ISO-13485:2016 certified, and ITAR registered. These certifications are important to ensure we meet your requirements for quality, regardless of the market(s) that you are working in.
Our over-molded QFN/DFN packages and pre-molded air-cavity QFN packages (OmPP) offer a fast, convenient solution for your needs, ranging from prototype to volume production. We offer same-day assembly services that reduce your time to market, while our advanced assembly services can accommodate such structures as flip chip, stacked die, SiP, chiplets, MCM and COB.