U.S. Chip Packaging
with Mil-Spec Precision

QP Technologies is your reliable IC packaging partner to build the future of mil-aero applications through Open-Cavity Plastic Packages (OCPP).

Download our white paper to learn:

• How you can transform your plastic package dummies, test rejects, and excess inventory into ready-to-assemble components
• The value of an onshore solution for navigating around ITAR supply constraints
• The benefits from producing chip prototypes that are mechanically and electrically identical to future molded production parts
• Why Open-Cavity Plastic Packages’ (OCPP) longevity and durability specs make them an ideal solution for mil-aero machinery

The white paper details a real-world use case where dummy IC packages converted to Open-Cavity Plastic Packages (OCPP) passed stringent burn-in and MSL tests just like factory-fresh parts. 

Download today to start unlocking the possibilities for your next IC packaging project.