News & Blog
February 2025 Newsletter
Subscribe to our email newsletter to stay updated on what’s happening at QP Technologies and our parent company, Promex Industries! Read our February 2025 newsletter for more on:
November 2024 Newsletter
Subscribe to our email newsletter to stay updated on what’s happening at QP Technologies and our parent company, Promex Industries! Read our November 2024 newsletter for more on:
Leveraging Custom Substrates to Deliver Quickturn Packaging and Assembly Solutions
Substrate materials play an important role in microelectronics. Serving as the backbone of integrated circuit assemblies, substrates promote mechanical strength and electrical connectivity. Manufacturers choose from a range of substrate materials when building devices, including advanced laminates such as FR-4, FR-5, BT and ABF. Driven by the advancement of applications […]
July 2024 Newsletter
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Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President
Two companies heightening focus on individual core competencies to better pursue rapidly expanding business opportunities. SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, and its San Diego-based division QP Technologies, a leading provider of innovative microelectronic packaging and assembly […]
QP Technologies™ Expands Die Preparation Business
Adds Fully Automated Dicing Saw to Equipment Line, Enabling Even Greater Precision, Throughput for Die Singulation ESCONDIDO, Calif. – June 19, 2024 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has added a state-of-the-art dicing saw to its manufacturing line, expanding its […]