System In Packaging
QP Technologies’ (formerly Quik-Pak) flexible assembly processes can accommodate the bonding of multiple components, including die and discretes, on a single substrate.
QP Technologies’ substrate experts will help you determine and develop the right substrate for your high-performance device requirements.
QP Technologies’ (formerly Quik-Pak) flexible assembly processes can accommodate the bonding of multiple components, including die and discretes, on a single substrate.