Design & Engineering
QP Technologies (formerly Quik-Pak) offers a range of design and engineering services to assist our customers to bring new products to market.
QP Technologies will design and fabricate custom packages (leaded packages, QFN’s, substrates, or OmPP) to your specifications, then complete the assembly process with your die, providing a complete turnkey solution for substrate-based assemblies, such as:
QP Technologies can also design custom frames to protect your open cavity devices, provide artwork support for marking and assist with generation of bonding diagrams. Partner with QP Technologies and make us an integral part of your new product introduction programs.