Die Attach
High Volume Precision Die Attach
QP Technologies (formerly Quik-Pak) offers fully automated die attach and die placement services for prototype and volume assembly.
- Accuracy within ± 10µm
- Die bond or flip chip attach
We utilize industry-standard materials for die attach and encapsulation, offering a range of options to meet your specific needs.
Die Attach Options
Non-conductive:
QMI538NB
Super Thermally & Electrically Conductive:
Sk70N
Solder:
Indium 6.3