Materials Information
QP Technologies (formerly Quik-Pak) utilizes industry standard materials for die attach and encapsulation, offering a range of options to meet your specific needs.
The below datasheets represent some of the materials that we have in stock for current customer programs. If a specific die attach or encapsulation material is needed that is not listed below, please ask since we may carry it. Contact QP Technologies customer service.
| Type | Download | ||
|---|---|---|---|
| Die Attach Option | Non-Conductive | 84-3 | Download PDF |
| Die Attach Option | Non-Conductive | QMI538NB | Download PDF |
| Die Attach Option | Conductive & Low Modulus | QMI529HT | Download PDF |
| Die Attach Option | Conductive | 84-1 LMI | Download PDF |
| Die Attach Option | Conductive | H20E | Download PDF |
| Die Attach Option | High Thermal & Electrical Conductivity | Atrox 800HT2V | Download PDF |
| Die Attach Option | High Thermal & Electrical Conductivity | Atrox 800HT5 | Download PDF |
| Die Attach Option | Solder | SN63 or SAC305/SAC405 | |
| Encapsulation Option | Standard | Hysol FP4450 | Download PDF |
| Encapsulation Option | Standard | Hysol FP4451 (Dam) / FP4450 (Fill) | Download PDF |
| Encapsulation Option | Low Stress | Hysol FP4651 | Download PDF |
| Overmold | Standard | Sumitomo EME-G770H Type D | Download PDF |
| Underfill | Standard | Namic U8443-14 | Download PDF |